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PCB laminate problems and solutions
Release time:2019-01-21Click:5046
 
 

1. There should be a reasonable trend:

For example, input/output, AC/DC, strong/weak signal, high frequency/low frequency, high voltage/low voltage, etc., their direction should be linear (or separated) and should not be mixed with each other. Its purpose is to prevent mutual interference. The best trend is straight, but it is not easy to achieve. The most unfavorable trend is circular. Fortunately, isolation can be set to improve. For DC, small signal, low voltage PCB design requirements can be lower. So "reasonable" is relative.

2. Choose a good grounding point:

How many engineers and technicians have discussed the small grounding point, which shows its importance. In general, common ground is required, for example, the multiple ground wires of the forward amplifier should be combined and then connected to the main ground. In reality, it is difficult to do it completely due to various restrictions, but we should try to follow it. This problem is quite flexible in practice. Everyone has his own set of solutions. It is easy to understand if it can be explained for specific circuit boards.

3. Reasonably arrange the power filter/decoupling capacitor:

Generally, only a few power supply filter/decoupling capacitors are drawn in the schematic diagram, but they are not indicated where they should be connected. In fact, these capacitors are set for switching devices (gate circuits) or other components that need filtering/decoupling. The capacitors should be arranged as close as possible to these components. Too far away will have no effect. Interestingly, when the power filter/decoupling capacitor is reasonably arranged, the problem of grounding point is not so obvious.

4. The lines are exquisite:

If conditions permit, the line that is wide will never be thin; High-voltage and high-frequency lines should be smooth, without sharp chamfers, and corners should not be right angles. The ground wire should be as wide as possible, and it is better to use large area of copper coating, which has greatly improved the problem of docking location.