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Pcb gold-plated plateThe process cost is the highest among all plates, but currently the most stable of all existing plates and is most suitable for use in lead-free processes. Especially in some electronic products with high unit prices or requiring high reliability, it is recommended to use this plate as a substrate.

2. OSP board

The OSP process has the lowest cost and is easy to operate. However, the popularity of this process is still poor due to the need for the assembly plant to modify the equipment and process conditions, and the poor repeatability. Using this kind of plate, after high temperature heating, the protective film pre-coated on the PAD will be damaged, which will lead to the reduction of solderability, especially when the substrate undergoes secondary reflow. Therefore, if the process needs to go through another DIP process, At this time, the DIP end will face welding challenges.

3. Chemical silver plate

Although "silver" itself has strong mobility, which leads to leakage, the current "silver immersion" is not pure metallic silver in the past, but "organic silver" co-plated with organic matter, so it can meet the requirements of lead-free process in the future, and its solderability life is longer than OSP board.

4. Chemical gold plate

The biggest problem of this kind of substrate is the problem of "BlackPad", so many large manufacturers do not agree to use it in the lead-free process, but most domestic manufacturers use this process.

5. Chemical tin plate

This kind of substrate is easy to be polluted and scratched, and the process (FLUX) will be oxidized and discolored. Most domestic manufacturers do not use this process, and the cost is relatively high.

6. Tin spray plate

Because of the low cost, good solderability, good reliability and strong compatibility, the lead-free process cannot be used because of the lead contained in the tin-sprayed plate with good soldering characteristics.