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NO | Iitems | Capabilities |
1 | Layer Counts | 2-16 |
2 | Max pannel size | 22"x32"(558mmx812mm) |
3 | Min line space/width | 3mil/3mil(0075mm/0075mm) |
4 | Mininner layer PAD | 4mil(0.1mm) |
5 | Mininner layer thick | 4mil(0.1mm) |
6 | Irner layer Cu thick | 0.5-2.0 oz |
7 | Hole wall thusck | 18-30um |
8 | HAL (lead free)tinthick | 150-1000u"(3.75-25um) |
9 | Outlayer Cuthick | 0.5-2.0 oz |
10 | Board thick range | 0.4-5.0mm |
11 | Board thick tolerance | ±10% |
12 | Stackup alignment | ±2mi1(±50um) |
13 | Min drill hole | 0.15mm |
14 | Hole to hole position | ±2mil(±50um) |
15 | Hole tolerance | ±1mil(±25um) |
16 | Throughhole aspect ratio | 10:01 |
17 | PAD alignment accuracy | 3mil/3mil(0.075mm/0.075mm) |
18 | Etching tolerance | ±10% |
19 | Min soldermask bridge | 3mil(0.075mm) |
20 | Max.plug via hole | 0.5mm |
21 | Surface treatment Capabilities |
HAL、ENIG、OSP、Carbonink、Gold finger、immersiontin、lmmersionsilver |
22 | Max hard gold thick | ≤100u"(≤2.5um) |
23 | ENIG thick | 1-3 UM" |
24 | Impedance tolerance | ±10% |
25 | Max.twist & warp | ≤0.75% |